Bluetooth 3.0 Gets Formally Adopted

Bluetooth SIG has announced today that it has formally adopted the Bluetooth Core Specification Version 3.0 High Speed (HS), also known as Bluetooth 3.0. The new release of the short-range wireless technology is meant to offer increased data transfer speeds and wireless Bluetooth experience at the same time. Manufacturers of devices that utilize the technology can now apply it in their products, offering users the possibility to send large amounts of video, music and photos between different electronics and home entertainment devices.

The increased speeds that Bluetooth 3.0 can offer come from the 802.11 radio protocol. The technology now includes the 802.11 Protocol Adaptation Layer (PAL), which allows for increased throughput of data transfers at speeds reaching almost 24 Mbps. At the same time, the new standard is also meant to offer increased power savings for mobile phones that use Bluetooth 3.0, courtesy of the built-in enhanced power control.

”The new iteration of Bluetooth technology is based on the inherent qualities of the current 2.1 EDR version, such as Simple Secure Pairing and built-in, automatic security. At the same time, Bluetooth 3.0 HS can offer developers, manufacturers and consumers backward compatibility with older standards, offering enhancements of the technology with every new specification release. Those who would like to learn more about the compatibility between Bluetooth-enabled devices should visit the Bluetooth Gadget Guide.

Among the applications that consumers will benefit from when it comes to Bluetooth version 3.0 HS we can count the Wireless bulk synchronization of music libraries between PC and music player or phone, Bulk download of photos to a printer or PC, as well as the ability to send video files from camera or phone to computer or television.

The formal adoption of the standard is only the first step in the lifecycle of Bluetooth 3.0. Wireless chip manufacturers and Bluetooth SIG member companies (including Atheros, Broadcom, CSR, and Marvell) will make the second step, namely providing device manufacturers with silicon solutions based on the technology. Products that will support the new standard are expected to come to market in about 9 to 12 months.